60

Foxconn Interconnect Technology LtdHKG 6088 Stock Report

Last reporting period 31 Dec, 2023

Updated 17 Sep, 2024

Last price

Market cap $B

1.682

Small

Exchange

XHKG - Hong Kong Exchange

6088.HK Stock Analysis

60

Uncovered

Foxconn Interconnect Technology Ltd is uncovered by Eyestock quantitative analysis.

Rating

To assess the quality of a company's business, we have collected all financial data from the statements and presented them in the form of a single number - the company's rating. Rating value of 100 is the threshold for determining a viable investment.

43/100

Low score

Market cap $B

1.682

Dividend yield

3.88 %

Shares outstanding

7 084.82 B

FIT Hon Teng Ltd. engages in the manufacturing, selling, and service of connectors, case, thermal module, wired/wireless communication products, optical products, power supply modules and assemblies. The company is headquartered in Taipei, New Taipei. The company went IPO on 2017-07-13. The firm and its subsidiaries are principally involved in the manufacture, sales and service of connector, case, thermal module, wired/wireless communication products, power supply modules, and assemblies for use in the information technology, communications, automotive equipment, precision molding, automobile, and consumer electronics industries. The firm distributes its products both to domestic and overseas markets.

View Section: Eyestock Rating