China Chippacking Technology Co LtdSHG 688216 Stock Report

China Chippacking Technology Co., Ltd. engages in the packaging and testing of integrated circuits. The company is headquartered in Shenzhen, Guangdong and currently employs 1,214 full-time employees. The company went IPO on 2021-06-23. Based on the development and application of integrated circuit packaging and testing technology, the Company is engaged in integrated circuit packaging, testing and providing packaging technology solutions. The firm's main packaging technology products include seven series, including Qipai, CPC, Small Outline Package (SOP), Small Outline Transistor (SOT), Low-profile Quad Flat Package (LQFP), Quad Flat No-lead Package (QFN/DFN), and Dual in line-pin package (DIP). The firm mainly conducts business within the domestic market.